Recently, Shenzhen Capital Group Co., Ltd ("SCGC") issued the second tranche of Innovation and Entrepreneurship Corporate Bonds via Shenzhen Stock Exchange (“SZSE”), which also issued a Letter of No Objection as regards the 680 million yuan private placement of Innovation and Entrepreneurship Bonds by Shenzhen Co-Stone Asset Management Co., Ltd. ("Co-Stone Asset") and 800 million yuan private placement of corporate bonds of the same nature by ChinaEquity Group ("CEG" for short). Since the release of the Guidance of China Securities Regulatory Commission on Lauching the Pilot Program of Innovation and Entrepreneurship Bonds, the Innovation and Entrepreneurship Bond pilot programs for venture capital firms have been ever expanding.
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